검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Tin Incorporated in Copper Films during Damascene Copper Electrodeposition Kitayaporn S, Huang Q, Hopstaken M, Baker-O'Neal B Journal of the Electrochemical Society, 162(1), D74, 2015 |
| 2 |
Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives Huang Q, Avekians A, Ahmed S, Parks C, Baker-O'Neal B, Kitayaporn S, Sahin A, Sun Y, Cheng T Journal of the Electrochemical Society, 161(9), D388, 2014 |
| 3 |
Laying out ground rules for protein-aided nanofabrication: ZnO synthesis at 70 degrees C as a case study Kitayaporn S, Zhou WB, Schwartz DT, Baneyx F Biotechnology and Bioengineering, 109(8), 1912, 2012 |