검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Determining the effects of slurry surfactant, abrasive size, and abrasive content on the tribology and kinetics of copper CMP Li Z, Ina K, Lefevre P, Koshiyama I, Philipossian A Journal of the Electrochemical Society, 152(4), G299, 2005 |
| 2 |
Effect of slurry flow rate on tribological, thermal, and removal rate attributes of copper CMP Li Z, Borucki L, Koshiyama I, Philipossian A Journal of the Electrochemical Society, 151(7), G482, 2004 |