검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications Singh R, Radu I, Reiche M, Himcinschi C, Kuck B, Tillack B, Gosele U, Christiansen SH Applied Surface Science, 253(7), 3595, 2007 |
| 2 |
Circuit applications of high-performance SiGe : C HBTs integrated in BiCMOS technology Winkler W, Borngraber J, Heinemann B, Rucker H, Barth R, Bauer J, Bolze D, Drews J, Ehwald KE, Grabolla T, Haak U, Hoppner W, Knoll D, Kruger D, Kuck B, Kurps R, Marschmeyer M, Richter H, Schley P, Schmidt D, Scholz R, Tillack B, Wolansky D, Wulf HE, Yamamoto Y, Zaumseil P Applied Surface Science, 224(1-4), 297, 2004 |
| 3 |
EPDM-based infill granules for artificial turf Kuck B, Neto A Kunststoffe-Plast Europe, 92(1), 84, 2002 |