| 1 |
Durability of resin bond strength to dental noble metal-ceramic alloys conditioned with novel mercapto silane-based primer systems
Kwon SM, Min BK, Son JS, Kim KH, Kwon TY
Journal of Adhesion Science and Technology, 30(5), 506, 2016 |
| 2 |
Metabolite Profiling of Diverse Rice Germplasm and Identification of Conserved Metabolic Markers of Rice Roots in Response to Long-Term Mild Salinity Stress
Nam MH, Bang E, Kwon TY, Kim Y, Kim EH, Cho K, Park WJ, Kim BG, Yoon IS
International Journal of Molecular Sciences, 16(9), 21959, 2015 |
| 3 |
Effect of dental silane primer activation time on resin-ceramic bonding
Lee Y, Chae M, Kim KH, Kwon TY
Journal of Adhesion Science and Technology, 29(11), 1155, 2015 |
| 4 |
Long-term release of chlorhexidine from dental adhesive resin system using human serum albumin nanoparticles
Kim HJ, Kwon TY, Kim KH, Kwon ST, Cho DH, Son JS
Polymer Bulletin, 71(4), 875, 2014 |
| 5 |
Anti-inflammatory drug releasing absorbable surgical sutures using poly(lactic-co-glycolic acid) particle carriers
Lee DH, Kwon TY, Kim KH, Kwon ST, Cho DH, Jang SH, Son JS, Lee KB
Polymer Bulletin, 71(8), 1933, 2014 |
| 6 |
Influence of surface energy parameters of dental self-adhesive resin cements on bond strength to dentin
Kim YK, Son JS, Kim KH, Kwon TY
Journal of Adhesion Science and Technology, 27(16), 1778, 2013 |
| 7 |
Effect of heat treatment of dental zirconia ceramic treated with three different primers on the bonding durability of resin cement
Ha JY, Son JS, Kim YK, Kim KH, Kwon TY
Macromolecular Research, 21(1), 71, 2013 |
| 8 |
Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation
Prasad YN, Kwon TY, Kim IK, Kim IG, Park JG
Journal of the Electrochemical Society, 158(4), H394, 2011 |
| 9 |
Hydrophobic Modification of Diamond Conditioner for Prevention of Particle Adhesion During Oxide CMP
Kim IK, Kwon TY, Kim DC, Park MS, Park JG
Journal of the Electrochemical Society, 158(9), H941, 2011 |
| 10 |
Citric Acid and NaIO4 Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning
Kim IK, Prasad YN, Kwon TY, Kim HM, Busnaina AA, Park JG
Journal of the Electrochemical Society, 158(10), H1052, 2011 |
