검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Process optimization and integration of trimethylsilane-deposited alpha-SiC : H and alpha-SiCO : H dielectric thin films for damascene processing Gray WD, Loboda MJ, Bremmer JN, Struyf H, Lepage M, Van Hove M, Donaton RA, Sleeckx E, Stucchi M, Lanckmans F, Gao T, Boullart W, Coenegrachts B, Maenhoudt M, Vanhaelemeersch S, Meynen H, Maex K Journal of the Electrochemical Society, 150(7), G404, 2003 |
| 2 |
A quantitative adhesion study between contacting materials in Cu damascene structures Lanckmans F, Brongersma SH, Varga I, Poortmans S, Bender H, Condard T, Maex K Applied Surface Science, 201(1-4), 20, 2002 |
| 3 |
Characterization of WF6/N-2/H-2 plasma enhanced chemical vapor deposited WxN films as barriers for Cu metallization Li H, Jin S, Bender H, Lanckmans F, Heyvaert I, Maex K, Froyen L Journal of Vacuum Science & Technology B, 18(1), 242, 2000 |