검색결과 : 9건
No. | Article |
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1 |
High-density plasma patterning of low dielectric constant polymers: A comparison between polytetrafluoroethylene, parylene-N, and poly(arylene ether) Standaert TEFM, Matsuo PJ, Li X, Oehrlein GS, Lu TM, Gutmann R, Rosenmayer CT, Bartz JW, Langan JG, Entley WR Journal of Vacuum Science & Technology A, 19(2), 435, 2001 |
2 |
Ion energy distributions and optical emission spectra in NF3-based process chamber cleaning plasmas Hsueh HP, McGrath RT, Ji B, Felker BS, Langan JG, Karwacki EJ Journal of Vacuum Science & Technology B, 19(4), 1346, 2001 |
3 |
C2F6/O-2 and C3F8/O-2 plasmas SiO2 etch rates, impedance analysis, and discharge emissions Entley WR, Hennessy WJ, Langan JG Electrochemical and Solid State Letters, 3(2), 99, 2000 |
4 |
Gas utilization in remote plasma cleaning and stripping applications Kastenmeier BEE, Oehrlein GS, Langan JG, Entley WR Journal of Vacuum Science & Technology A, 18(5), 2102, 2000 |
5 |
Silicon etching in NF3/O-2 remote microwave plasmas Matsuo PJ, Kastenmeier BEE, Oehrlein GS, Langan JG Journal of Vacuum Science & Technology A, 17(5), 2431, 1999 |
6 |
Evaluation of trifluoroacetic anhydride as an alternative plasma enhanced chemical vapor deposition chamber clean chemistry Pruette LC, Karecki SM, Reif R, Langan JG, Rogers SA, Ciotti RJ, Felker BS Journal of Vacuum Science & Technology A, 16(3), 1577, 1998 |
7 |
Remote plasma etching of silicon nitride and silicon dioxide using NF3/O-2 gas mixtures Kastenmeier BEE, Matsuo PJ, Oehrlein GS, Langan JG Journal of Vacuum Science & Technology A, 16(4), 2047, 1998 |
8 |
Electrical impedance analysis and etch rate maximization in NF3/Ar discharges Langan JG, Rynders SW, Felker BS, Beck SE Journal of Vacuum Science & Technology A, 16(4), 2108, 1998 |
9 |
Electrical optimization of plasma-enhanced chemical vapor deposition chamber cleaning plasmas Sobolewski MA, Langan JG, Felker BS Journal of Vacuum Science & Technology B, 16(1), 173, 1998 |