검색결과 : 9건
| No. | Article |
|---|---|
| 1 |
Copper diffusion in Ti-Si-N layers formed by inductively coupled plasma implantation Ee YC, Chen Z, Law SB, Xu S, Yakovlev NL, Lai MY Applied Surface Science, 253(2), 530, 2006 |
| 2 |
Low temperature physical-chemical vapor deposition of Ti-Si-N-O barrier films Ee YC, Chen Z, Lu TM, Dong ZL, Law SB Electrochemical and Solid State Letters, 9(3), G100, 2006 |
| 3 |
Bias-temperature stability of Ti-Si-N-O films Ee YC, Juneja JS, Wang PI, Lu TM, Bakhru H, Chan L, Law SB, Yong C, Chen Z, Xu S Journal of the Electrochemical Society, 153(5), G470, 2006 |
| 4 |
Formation and characterization of Ti-Si-N-O barrier films Ee YC, Chen Z, Law SB, Xu S Thin Solid Films, 504(1-2), 218, 2006 |
| 5 |
Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process Ee YC, Chen Z, Chan L, See KH, Law SB, Xu S, Tsakadze ZL, Rutkevych PP, Zeng KY, Shen L Journal of Vacuum Science & Technology B, 23(6), 2444, 2005 |
| 6 |
Classification of palladium nucleation processes based on nucleus size distribution Lau PP, Wong CC, Chan L, See A, Law SB Journal of the Electrochemical Society, 151(6), C436, 2004 |
| 7 |
Electroless copper deposition as a seed layer on TiSiN barrier Ee YC, Chen Z, Xu S, Chan L, See KH, Law SB Journal of Vacuum Science & Technology A, 22(4), 1852, 2004 |
| 8 |
Effect of processing parameters on electroless Cu seed layer properties Ee YC, Chen Z, Chan L, See AKH, Law SB, Tee KC, Zeng KY, Shen L Thin Solid Films, 462-63, 197, 2004 |
| 9 |
Endurance of thermoset resins for flip chip encapsulation Sarkar G, Ng HW, Law SB Journal of Materials Science Letters, 18(5), 423, 1999 |