검색결과 : 9건
| No. | Article |
|---|---|
| 1 |
Flexible Low-Voltage Organic Complementary Circuits: Finding the Optimum Combination of Semiconductors and Monolayer Gate Dielectrics Kraft U, Sejfic M, Kang MJ, Takimiya K, Zaki T, Letzkus F, Burghartz JN, Weber E, Klauk H Advanced Materials, 27(2), 207, 2015 |
| 2 |
Argon ion multibeam nanopatterning of Ni-Cu inserts for injection molding Koeck A, Bruck R, Wellenzohn M, Hainberger R, Platzgummer E, Loeschner H, Joechl P, Eder-Kapl S, Ebm C, Czepl P, Kaiblinger K, Pipelka F, Letzkus F, Irmscher M, Heitkamp B Journal of Vacuum Science & Technology B, 28(6), C6B1, 2010 |
| 3 |
Ion multibeam nanopatterning for photonic applications: Experiments and simulations, including study of precursor gas induced etching and deposition Ebm C, Platzgummer E, Loeschner H, Eder-Kapl S, Joechl P, Kuemmel M, Reitinger R, Hobler G, Koeck A, Hainberger R, Wellenzohn M, Letzkus F, Irmscher M Journal of Vacuum Science & Technology B, 27(6), 2668, 2009 |
| 4 |
Nanopatterning of magnetic disks by single-step Ar+ ion projection Dietzel A, Berger R, Loeschner H, Platzgummer E, Stengl G, Bruenger WH, Letzkus F Advanced Materials, 15(14), 1152, 2003 |
| 5 |
Thermal emissivity of carbon coated p-doped silicon stencil masks for ion projection lithography Braun D, Gajic R, Kuchar F, Korntner R, Haugeneder E, Loeschner H, Butschke J, Letzkus F, Springer R Journal of Vacuum Science & Technology B, 21(1), 123, 2003 |
| 6 |
Comparison of silicon stencil mask distortion measurements with finite element analysis Ehrmann A, Struck T, Chalupka A, Haugeneder E, Loschner H, Butschke J, Irmscher M, Letzkus F, Springer R, Degen A, Rangelow IW, Shi F, Sossna E, Volland B, Engelstad R, Lovell E, Tejeda R Journal of Vacuum Science & Technology B, 17(6), 3107, 1999 |
| 7 |
Comparative evaluation of electron-beam sensitive single layer top surface imaging and bilayer chemical amplification of resist lines process for stencil mask making Elian K, Irmscher M, Butschke J, Letzkus F, Reuter C, Springer R Journal of Vacuum Science & Technology B, 17(6), 3122, 1999 |
| 8 |
Directly sputtered stress-compensated carbon protective layer for silicon stencil masks Hudek P, Hrkut P, Drzik M, Kostic I, Belov M, Torres J, Wasson J, Wolfe JC, Degen A, Rangelow IW, Voigt J, Butschke J, Letzkus F, Springer R, Ehrmann A, Kaesmaier R, Kragler K, Mathuni J, Haugeneder E, Loschner H Journal of Vacuum Science & Technology B, 17(6), 3127, 1999 |
| 9 |
p-n junction-based wafer flow process for stencil mask fabrication Rangelow IW, Shi F, Volland B, Sossna E, Petrashenko A, Hudek P, Sunyk R, Butschke J, Letzkus F, Springer R, Ehrmann A, Gross G, Kaesmaier R, Oelmann A, Struck T, Unger G, Chalupka A, Haugeneder E, Lammer G, Loschner H, Tejeda R, Lovell E, Engelstad R Journal of Vacuum Science & Technology B, 16(6), 3592, 1998 |