검색결과 : 33건
| No. | Article |
|---|---|
| 1 |
Sulfur-Resistant Cu0.7Ni0.3Fe2O4 Catalyst for Removing NO from Diesel Exhausts Liang MS, Chen YC, Li L, Xin B, Lai ZJ Catalysis Letters, 150(9), 2572, 2020 |
| 2 |
Development of shaped NiCoMg/gamma-Al2O3 catalyst with commercial support for CO2 reforming of CH4 Liang MS, Tian L, Shakouri M, Hu YF, Wang H Catalysis Today, 291, 76, 2017 |
| 3 |
Low-temperature deposition of VO2 films with high crystalline degree by embedding multilayered structure Sun GY, Cao X, Li XY, Bao SH, Li N, Liang MS, Gloter A, Gu H, Jin P Solar Energy Materials and Solar Cells, 161, 70, 2017 |
| 4 |
The effects of STI induced mechanical strain on GIDL current in Hf-based and SiON MOSFETs Cheng CY, Fang YK, Liao JC, Wang TJ, Hou YT, Hsu PF, Lin KC, Huang KT, Lee TL, Liang MS Solid-State Electronics, 53(8), 892, 2009 |
| 5 |
Thermal stability of C-doped GaAs/AlAs DBR structures Liang MS, Bullough TJ, Joyce TB Solid-State Electronics, 52(8), 1256, 2008 |
| 6 |
Observations in trapping characteristics of positive bias temperature instability on high-k/metal gate n-type metal oxide semiconductor field effect transistor with the complementary multi-pulse technique Liao JC, Fang YK, Hou YT, Wu WH, Hung CL, Hsu PF, Lin KC, Huang KT, Lee TL, Liang MS Thin Solid Films, 516(12), 4222, 2008 |
| 7 |
Characterization of Pd-free electroless Co-based cap selectively deposited on Cu surface via borane-based reducing agent Chang SY, Wan CC, Wang YY, Shih CH, Tsai MH, Shue SL, Yu CH, Liang MS Thin Solid Films, 515(3), 1107, 2006 |
| 8 |
Diffusion of copper in titanium zirconium nitride thin films Kuo YL, Lee HH, Lee C, Lin JC, Shue SL, Liang MS, Daniels BJ Electrochemical and Solid State Letters, 7(3), C35, 2004 |
| 9 |
TDDB reliability improvement of Cu damascene with a bilayer-structured alpha-SiC : H dielectric barrier Chiang CC, Chen MC, Wu ZC, Li LJ, Jang SM, Yu CH, Liang MS Journal of the Electrochemical Society, 151(2), G89, 2004 |
| 10 |
Leakage and breakdown mechanisms of Cu comb capacitors with bilayer-structured alpha-SiCN/alpha-SiC Cu-cap barriers Chiang CC, Ko IH, Chen MC, Wu ZC, Lu YC, Jang SM, Liang MS Journal of the Electrochemical Society, 151(2), G93, 2004 |