검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects Kelly J, Nogami T, van der Straten O, Demarest J, Li J, Penny C, Vo T, Parks C, Dehaven P, Hu CK, Liniger E Journal of the Electrochemical Society, 159(10), D563, 2012 |
| 2 |
Line resistance and electromigration variations induced by hydrogen-based plasma modifications to the silicon carbonitride/copper interface Ryan ET, Martin J, Bonilla G, Molis S, Spooner T, Widodo J, Kim JH, Liniger E, Grill A, Hu CK Journal of the Electrochemical Society, 154(7), H604, 2007 |
| 3 |
Comparison of electromigration in cu interconnects with atomic-layer-or physical-vapor-deposited TaN liners Hu CK, Gignac L, Liniger E, Grunow S, Demarest JJ, Redder B, Simon A, Liew SL Journal of the Electrochemical Society, 154(9), H755, 2007 |
| 4 |
Electromigration cu mass flow in cu interconnections Hu CK, Canaperi D, Chen ST, Gignac LM, Kaldor S, Krishnan M, Malhotra SG, Liniger E, Lloyd JR, Rath DL, Restaino D, Rosenberg R, Rubino J, Seo SC, Simon A, Smith S, Tseng WT Thin Solid Films, 504(1-2), 274, 2006 |
| 5 |
Electromigration in on-chip single/dual damascene Cu interconnections Hu CK, Gignac L, Liniger E, Rosenberg R Journal of the Electrochemical Society, 149(7), G408, 2002 |