검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength Pang JHL, Low TH, Xiong BS, Xu LH, Neo CC Thin Solid Films, 462-63, 370, 2004 |
| 2 |
Low cycle fatigue models for lead-free solders Pang JHL, Xiong BS, Low TH Thin Solid Films, 462-63, 408, 2004 |