화학공학소재연구정보센터
검색결과 : 87건
No. Article
1 Numerical modeling and experimental validation of two-phase microfluidic cooling in silicon devices for vertical integration of microelectronics
Lorenzini D, Joshi Y
International Journal of Heat and Mass Transfer, 138, 194, 2019
2 99.992% Si-28 CVD-grown epilayer on 300 mm substrates for large scale integration of silicon spin qubits
Mazzocchi V, Sennikov PG, Bulanov AD, Churbanov MF, Bertrand B, Hutin L, Barnes JP, Drozdov MN, Hartmann JM, Sanquer M
Journal of Crystal Growth, 509, 1, 2019
3 Massively manufactured paper-based all-solid-state flexible micro-supercapacitors with sprayable MXene conductive inks
Huang HC, Chu X, Su H, Zhang HT, Xie YT, Deng W, Chen NJ, Liu FY, Zhang HP, Gu BN, Deng WL, Yang WQ
Journal of Power Sources, 415, 1, 2019
4 Influence of indenter tip diameter and film thickness on flat indentations into elastic-plastic films by means of the finite element method
Brezmes AO, Breitkopf C
Thin Solid Films, 653, 49, 2018
5 A novel patterning effect during high frequency laser micro-cutting of hard ceramics for microelectronics applications
Savriama G, Jarry V, Barreau L, Boulmer-Leborgne C, Semmar N
Applied Surface Science, 302, 163, 2014
6 Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects
Sinha K, Farley D, Kahnert T, Solares SD, Dasgupta A, Caers JFJ, Zhao XJ
Journal of Adhesion Science and Technology, 28(12), 1167, 2014
7 Metal Organic Chemical Vapor Deposition of nickel oxide thin films for wide band gap device technology
Lo Nigro R, Battiato S, Greco G, Fiorenza P, Roccaforte F, Malandrino G
Thin Solid Films, 563, 50, 2014
8 Probing strain at the nanoscale with X-ray diffraction in microelectronic materials induced by stressor elements
Murray CE, Polvino SM, Noyan IC, Cai Z, Maser J, Holt M
Thin Solid Films, 530, 85, 2013
9 Extended defects and precipitation in heavily B-doped silicon
Cojocaru-Miredin O, Cristiano F, Fazzini PF, Mangelinck D, Blavette D
Thin Solid Films, 534, 62, 2013
10 Autonomic Restoration of Electrical Conductivity
Blaiszik BJ, Kramer SLB, Grady ME, McIlroy DA, Moore JS, Sottos NR, White SR
Advanced Materials, 24(3), 398, 2012