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| No. | Article |
|---|---|
| 1 |
45 nm node back end of the line yield evaluation on ultrahigh density interconnect structures using electron beam direct write lithography Icard B, Pain L, Arnal V, Manakli S, Le-Denmat JC, Brun P, Vincent M, Soonkindt C, Minghetti B, Matsumiya T Journal of Vacuum Science & Technology B, 25(1), 124, 2007 |