| 1 |
Control of the kerf size and microstructure in Inconel 738 superalloy by femtosecond laser beam cutting
Wei J, Ye Y, Sun Z, Liu L, Zou G
Applied Surface Science, 370, 364, 2016 |
| 2 |
Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry
Cheng J, Wang TQ, He YY, Lu XC
Applied Surface Science, 337, 130, 2015 |
| 3 |
Study of material removal processes of the crystal silicon substrate covered by an oxide film under a silica cluster impact: Molecular dynamics simulation
Chen RL, Wu YH, Lei H, Jiang RR, Liang M
Applied Surface Science, 305, 609, 2014 |
| 4 |
Characterization of colloidal silica abrasives with different sizes and their chemical-mechanical polishing performance on 4H-SiC (0 0 0 1)
Shi XL, Pan GS, Zhou Y, Gu ZH, Gong H, Zou CL
Applied Surface Science, 307, 414, 2014 |
| 5 |
Material removal mechanism during porous silica cluster impact on crystal silicon substrate studied by molecular dynamics simulation
Chen RL, Jiang RR, Lei H, Liang M
Applied Surface Science, 264, 148, 2013 |
