검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
Surface etching mechanism of silicon nitride in fluorine and nitric oxide containing plasmas Kastenmeier BEE, Matsuo PJ, Oehrlein GS, Ellefson RE, Frees LC Journal of Vacuum Science & Technology A, 19(1), 25, 2001 |
| 2 |
High-density plasma patterning of low dielectric constant polymers: A comparison between polytetrafluoroethylene, parylene-N, and poly(arylene ether) Standaert TEFM, Matsuo PJ, Li X, Oehrlein GS, Lu TM, Gutmann R, Rosenmayer CT, Bartz JW, Langan JG, Entley WR Journal of Vacuum Science & Technology A, 19(2), 435, 2001 |
| 3 |
Patterning of fluorine-, hydrogen-, and carbon-containing SiO2-like low dielectric constant materials in high-density fluorocarbon plasmas: Comparison with SiO2 Standaert TEFM, Matsuo PJ, Allen SD, Oehrlein GS, Dalton TJ Journal of Vacuum Science & Technology A, 17(3), 741, 1999 |
| 4 |
Silicon etching in NF3/O-2 remote microwave plasmas Matsuo PJ, Kastenmeier BEE, Oehrlein GS, Langan JG Journal of Vacuum Science & Technology A, 17(5), 2431, 1999 |
| 5 |
Highly selective etching of silicon nitride over silicon and silicon dioxide Kastenmeier BEE, Matsuo PJ, Oehrlein GS Journal of Vacuum Science & Technology A, 17(6), 3179, 1999 |
| 6 |
Effect of capacitive coupling on inductively coupled fluorocarbon plasma processing Schaepkens M, Rueger NR, Beulens JJ, Li X, Standaert TEFM, Matsuo PJ, Oehrlein GS Journal of Vacuum Science & Technology A, 17(6), 3272, 1999 |
| 7 |
Characterization of Al, Cu, and TiN surface cleaning following a low-K dielectric etch Matsuo PJ, Standaert TEFM, Allen SD, Oehrlein GS, Dalton TJ Journal of Vacuum Science & Technology B, 17(4), 1435, 1999 |
| 8 |
Remote plasma etching of silicon nitride and silicon dioxide using NF3/O-2 gas mixtures Kastenmeier BEE, Matsuo PJ, Oehrlein GS, Langan JG Journal of Vacuum Science & Technology A, 16(4), 2047, 1998 |
| 9 |
Role of N-2 Addition on CF4/O-2 Remote Plasma Chemical Dry-Etching of Polycrystalline Silicon Matsuo PJ, Kastenmeier BE, Beulens JJ, Oehrlein GS Journal of Vacuum Science & Technology A, 15(4), 1801, 1997 |
| 10 |
Chemical Dry-Etching of Silicon-Nitride and Silicon Dioxide Using CF4/O-2/N-2 Gas-Mixtures Kastenmeier BE, Matsuo PJ, Beulens JJ, Oehrlein GS Journal of Vacuum Science & Technology A, 14(5), 2802, 1996 |