검색결과 : 94건
| No. | Article |
|---|---|
| 1 |
Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias Josell D, Menk LA, Hollowell AE, Blain M, Moffat TP Journal of the Electrochemical Society, 166(1), D3254, 2019 |
| 2 |
Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias Braun TM, Josell D, Silva M, Kildon J, Moffat TP Journal of the Electrochemical Society, 166(1), D3259, 2019 |
| 3 |
Accelerated Bottom-Up Gold Filling of Metallized Trenches Josell D, Williams ME, Ambrozik S, Zhang C, Moffat TP Journal of the Electrochemical Society, 166(12), D487, 2019 |
| 4 |
Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings Josell D, Ambrozik S, Williams ME, Hollowell AE, Arrington C, Muramoto S, Moffat TP Journal of the Electrochemical Society, 166(16), D898, 2019 |
| 5 |
Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown Josell D, Moffat TP Journal of the Electrochemical Society, 165(2), D23, 2018 |
| 6 |
Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology Menk LA, Josell D, Moffat TP, Baca E, Blain MG, Smith A, Dominguez J, McClain J, Yeh PD, Hollowell AE Journal of the Electrochemical Society, 166(1), D3066, 2018 |
| 7 |
Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte Josell D, Moffat TP Journal of the Electrochemical Society, 166(1), D3022, 2018 |
| 8 |
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction (vol 165, pg D23, 2018) Braun TM, Kim SH, Lee HJ, Moffat TP, Josell D Journal of the Electrochemical Society, 165(11), X11, 2018 |
| 9 |
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction Braun TM, Kim SH, Lee HJ, Moffat TP, Josell D Journal of the Electrochemical Society, 165(7), D291, 2018 |
| 10 |
Mapping Electron Transfer at MoS2 Using Scanning Electrochemical Microscopy Ritzert NL, Szalai VA, Moffat TP Langmuir, 34(46), 13864, 2018 |