검색결과 : 8건
| No. | Article |
|---|---|
| 1 |
Study of high-temperature Smart Cut (TM): Application to silicon-on-sapphire films and to thin foils of single crystal silicon Meyer R, Kononchuck O, Moriceau H, Lemiti M, Bruel M Solid-State Electronics, 115, 225, 2016 |
| 2 |
Atomic scale fabrication of dangling bond structures on hydrogen passiyated Si(001) wafers processed and nanopackaged in a clean room environment Kolmer M, Godlewski S, Zuzak R, Wojtaszek M, Rauer C, Thuaire A, Hartmann JM, Moriceau H, Joachim C, Szymonski M Applied Surface Science, 288, 83, 2014 |
| 3 |
H2O Diffusion Barriers at Si-Si Direct Bonding Interfaces for Low Temperature Anneals Moriceau H, Rieutord F, Libralesso L, Ventosa C, Fournel F, Morales C, Mc Cormick T, Chevolleau T, Radu I Journal of the Electrochemical Society, 158(9), H919, 2011 |
| 4 |
Mechanism of Thermal Silicon Oxide Direct Wafer Bonding Ventosa C, Morales C, Libralesso L, Fournel F, Papon AM, Lafond D, Moriceau H, Penot JD, Rieutord F Electrochemical and Solid State Letters, 12(10), H373, 2009 |
| 5 |
Prebonding Thermal Treatment in Direct Si-Si Hydrophilic Wafer Bonding Ventosa C, Rieutord F, Libralesso L, Fournel F, Morales C, Moriceau H Journal of the Electrochemical Society, 156(11), H818, 2009 |
| 6 |
Backside and frontside depth profiling of B delta doping, at low energy, using new and previous magnetic SIMS instruments Laugier F, Hartmann JM, Moriceau H, Holliger P, Truche R, Dupuy JC Applied Surface Science, 231-2, 668, 2004 |
| 7 |
Engineering strained silicon on insulator wafers with the Smart Cut (TM) technology Ghyselen B, Hartmann JM, Ernst T, Aulnette C, Osternaud B, Bogumilowicz Y, Abbadie A, Besson P, Rayssac O, Tiberj A, Daval N, Cayrefourq I, Fournel F, Moriceau H, Di Nardo C, Andrieu F, Paillard V, Cabie M, Vincent L, Snoeck E, Cristiano F, Rocher A, Ponchet A, Claverie A, Boucaud P, Semeria MN, Bensahel D, Kernevez B, Mazure C Solid-State Electronics, 48(8), 1285, 2004 |
| 8 |
Nanometric patterning with ultrathin twist bonded silicon wafers Fournel F, Moriceau H, Magnea N, Eymery J, Buttard D, Rouviere JL, Rousseau K, Aspar B Thin Solid Films, 380(1-2), 10, 2000 |