검색결과 : 1건
No. | Article |
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1 |
Thermal characterization of an epoxy-based underfill material for flip chip packaging He Y, Moreira BE, Overson A, Nakamura SH, Bider C, Briscoe JF Thermochimica Acta, 357-358, 1, 2000 |
No. | Article |
---|---|
1 |
Thermal characterization of an epoxy-based underfill material for flip chip packaging He Y, Moreira BE, Overson A, Nakamura SH, Bider C, Briscoe JF Thermochimica Acta, 357-358, 1, 2000 |