검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Bottom-up copper fill with addition of mercapto alkyl carboxylic acid in electroless plating Wang ZL, Obata R, Sakaue H, Takahagi T, Shingubara S Electrochimica Acta, 51(12), 2442, 2006 |
| 2 |
Bottom-up fill of copper in deep submicrometer holes by electroless plating Shingubara S, Wang ZL, Yaegashi O, Obata R, Sakaue H, Takahagi T Electrochemical and Solid State Letters, 7(6), C78, 2004 |
| 3 |
Electrochemical formation of iron nitride film in a molten LiCl-KCl-Li3N system Goto T, Obata R, Ito Y Electrochimica Acta, 45(20), 3367, 2000 |
| 4 |
Relative and Absolute Stereochemistry of Pyripyropene-A, a Potent, Bioavailable Inhibitor of Acyl-CoA-Cholesterol Acyltransferase (Acat) Tomoda H, Nishida H, Kim YK, Obata R, Sunazuka T, Omura S, Bordner J, Guadliana M, Dormer PG, Smith AB Journal of the American Chemical Society, 116(26), 12097, 1994 |