검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Experimental measurement of the effect of copper through-silicon via diameter on stress buildup using synchrotron-based X-ray source Okoro C, Levine LE, Xu RQ, Obeng Y Journal of Materials Science, 50(18), 6236, 2015 |
| 2 |
Formation and dissolution of copper-based nanoparticles in SiO2 sol-gel film using heat treatment and/or UV light exposure Massera J, Choi J, Petit L, Richardson M, Obeng Y, Richardson K Materials Research Bulletin, 43(11), 3130, 2008 |
| 3 |
Metrology and characterization of application specific chemical mechanical polishing pads Zantye PB, Mudhivarthi S, Kumar A, Obeng Y Journal of Vacuum Science & Technology A, 23(5), 1392, 2005 |
| 4 |
Chemical mechanical planarization of copper: Role of oxidants and inhibitors Deshpande S, Kuiry SC, Klimov M, Obeng Y, Seal S Journal of the Electrochemical Society, 151(11), G788, 2004 |