검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Superconformal Filling of High Aspect Ratio through Glass Vias (TGV) for Interposer Applications Using TNBT and NTBC Additives Ogutu P, Fey E, Dimitrov N Journal of the Electrochemical Society, 162(9), D457, 2015 |
| 2 |
Seeding strategies for the deposition of high density network of nanoporous Au cluster catalyst on glassy carbon electrodes Kamundi M, Bromberg L, Ogutu P, Dimitrov N Journal of Applied Electrochemistry, 43(9), 879, 2013 |
| 3 |
Hybrid Method for Metallization of Glass Interposers Ogutu P, Fey E, Borgesen P, Dimitrov N Journal of the Electrochemical Society, 160(12), D3228, 2013 |