검색결과 : 8건
| No. | Article |
|---|---|
| 1 |
Characterization of interface and border traps in ALD Al2O3/GaN MOS capacitors with two-step surface pretreatments on Ga-polar GaN Gu S, Chagarov EA, Min J, Madisetti S, Novak S, Oktyabrsky S, Kerr AJ, Kaufman-Osborn T, Kummel AC, Asbeck PM Applied Surface Science, 317, 1022, 2014 |
| 2 |
Atomic Imaging of the Irreversible Sensing Mechanism of NO2 Adsorption on Copper Phthalocyanine Park JH, Royer JE, Chagarov E, Kaufman-Osborn T, Edmonds M, Kent T, Lee S, Trogler WC, Kummel AC Journal of the American Chemical Society, 135(39), 14600, 2013 |
| 3 |
Effect of near-substrate plasma density in the reactive magnetron sputter deposition of hydrogenated amorphous germanium Kaufman-Osborn T, Pollock KM, Hiltrop J, Braam K, Fazzio S, Doyle JR Thin Solid Films, 520(6), 1866, 2012 |
| 4 |
Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections Osborn T, Galiba N, Kohl PA Journal of the Electrochemical Society, 156(7), D226, 2009 |
| 5 |
All-copper chip-to-substrate interconnects - Part I. Fabrication and characterization Osborn T, He A, Galiba N, Kohl PA Journal of the Electrochemical Society, 155(4), D308, 2008 |
| 6 |
All-copper chip-to-substrate interconnects - Part II. Modeling and design He A, Osborn T, Allen SAB, Kohl PA Journal of the Electrochemical Society, 155(4), D314, 2008 |
| 7 |
Platinum-glass composite electrode for fuel cell applications Mustain WE, Kim H, Prakash S, Stark J, Osborn T, Kohl PA Electrochemical and Solid State Letters, 10(12), B210, 2007 |
| 8 |
Low-temperature bonding of copper pillars for all-copper chip-to-substrate interconnections He A, Osborn T, Allen SAB, Kohl PA Electrochemical and Solid State Letters, 9(12), C192, 2006 |