검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
On the Use of Silver Plated Nano Aluminum Nitride and Silver Plated Chopped Carbon Fiber to Prepare Electrically Conductive Adhesives with High Thermal Conductivity Ma H, Qi SH Journal of Adhesion, 92(12), 982, 2016 |
| 2 |
Underlying mechanisms behind adhesion of fermented milk to packaging surfaces Cragnell C, Hansson K, Andersson T, Jonsson B, Skepo M Journal of Food Engineering, 130, 52, 2014 |
| 3 |
Pulsed Light inactivation of Listeria innocua on food packaging materials of different surface roughness and reflectivity Ringus DL, Moraru CI Journal of Food Engineering, 114(3), 331, 2013 |
| 4 |
Study of multilayer packaging delamination mechanisms using different surface analysis techniques Garrido-Lopez A, Tena MT Applied Surface Science, 256(12), 3799, 2010 |