검색결과 : 1건
No. | Article |
---|---|
1 |
Pad flattening ratio, coefficient of friction and removal rate analysis during silicon dioxide chemical mechanical planarization Lee H, Zhuang Y, Sugiyama M, Seike Y, Takaoka M, Miyachi K, Nishiguchi T, Kojima H, Philipossian A Thin Solid Films, 518(8), 1994, 2010 |