검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI Paik JM, Park IM, Joo YC Thin Solid Films, 504(1-2), 284, 2006 |
| 2 |
Microtexture measurement of copper damascene line with EBSD Kim DI, Paik JM, Joo YC, Oh KH, Lee HC, Dicks K Materials Science Forum, 408-4, 529, 2002 |
| 3 |
Effect of line geometries on textures in damascene Cu lines Paik JM, Joo YC Materials Science Forum, 408-4, 1555, 2002 |