검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias Dixit P, Yaofeng S, Miao JM, Pang JHL, Chatterjee R, Tummalaa RR Journal of the Electrochemical Society, 155(12), H981, 2008 |
| 2 |
Nano-indentation characterization of Ni-Cu-SnIMC layer subject to isothermal aging Xu LH, Pang JHL Thin Solid Films, 504(1-2), 362, 2006 |
| 3 |
Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength Pang JHL, Low TH, Xiong BS, Xu LH, Neo CC Thin Solid Films, 462-63, 370, 2004 |
| 4 |
Low cycle fatigue models for lead-free solders Pang JHL, Xiong BS, Low TH Thin Solid Films, 462-63, 408, 2004 |