검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Correlation between viscoelastic behavior and cooling stresses in a cured epoxy resin system Nassiet V, Habas JP, Hassoune-Rhabbour B, Baziard Y, Petit JA Journal of Applied Polymer Science, 99(3), 679, 2006 |
| 2 |
Study of bonded plasma-treated polyetherimide components for power integration: Durability in a hot/wet environment Evieux J, Montois P, Nassiet V, Baziard Y, Petit JA, Dedryvere R Journal of Adhesion, 80(4), 263, 2004 |
| 3 |
Structural adhesive bonding of sintered silicon carbide (SSiC) subjected to thermal treatment in air atmosphere Levallois F, Helt S, Baziard Y, Petit JA Journal of Adhesion Science and Technology, 13(2), 273, 1999 |
| 4 |
A new tensile rupture test for the mechanical characterization of an adhesively-bonded structural ceramic assembly Amara D, Hassoune B, El Abdi R, Baziard Y, Petit JA Journal of Adhesion Science and Technology, 12(10), 1029, 1998 |
| 5 |
Study of the crack deviation angle in adhesive ruptures of ceramic adhesively-bonded assemblies Levallois F, El Abdi R, Baziard Y, Petit JA Journal of Adhesion, 60(1), 1, 1997 |
| 6 |
Study of a single-lap compression-shear test for brittle substrates bonded with a structural adhesive Amara D, Levallois F, Baziard Y, Petit JA Journal of Adhesion Science and Technology, 10(11), 1153, 1996 |