검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process Wang Y, Bian C, Jing XL Applied Surface Science, 271, 303, 2013 |
| No. | Article |
|---|---|
| 1 |
Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process Wang Y, Bian C, Jing XL Applied Surface Science, 271, 303, 2013 |