검색결과 : 51건
| No. | Article |
|---|---|
| 1 |
Effect of Slurry Application/Injection Schemes on Slurry Availability during Chemical Mechanical Planarization (CMP) Liao XY, Sampurno Y, Zhuang Y, Philipossian A Electrochemical and Solid State Letters, 15(4), H118, 2012 |
| 2 |
Tribological, Thermal and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes Jiao YB, Liao XY, Wu CH, Theng S, Zhuang Y, Sampurno Y, Goldstein M, Philipossian A Journal of the Electrochemical Society, 159(3), H255, 2012 |
| 3 |
Effect of concentric slanted pad groove patterns on slurry flow during chemical mechanical planarization Rosales-Yeomans D, Lee H, Suzuki T, Philipossian A Thin Solid Films, 520(6), 2224, 2012 |
| 4 |
Effect of Pad Surface Micro-Texture on Coefficient of Friction and Removal Rate during Copper CMP Process Liao X, Zhuang Y, Borucki LJ, Theng S, Wei X, Ashizawa T, Philipossian A Electrochemical and Solid State Letters, 14(5), H201, 2011 |
| 5 |
An Approach for Correlating Friction Force and Removal Rate to Pad Topography during Tungsten Chemical Mechanical Planarization Sampurno Y, Rice A, Zhuang Y, Philipossian A Electrochemical and Solid State Letters, 14(8), H318, 2011 |
| 6 |
Effect of Retaining Ring Slot Design on Slurry Film Thickness during CMP Wei XM, Sampurno YA, Zhuang Y, Dittler R, Meled A, Cheng J, Wargo C, Stankowski R, Philipossian A Electrochemical and Solid State Letters, 13(4), H119, 2010 |
| 7 |
Tribological, Thermal, and Wear Characteristics of Poly(phenylene sulfide) and Polyetheretherketone Retaining Rings in Interlayer Dielectric CMP Wei XM, Zhuang Y, Sampurno Y, Sudargho F, Wargo C, Borucki L, Philipossian A Electrochemical and Solid State Letters, 13(11), H391, 2010 |
| 8 |
Diamond Disc Diagnostic Method Based on "Dry" Coefficient of Friction Measurements Meled A, Sampurno Y, Sudargho F, Zhuang Y, Philipossian A Electrochemical and Solid State Letters, 13(12), H457, 2010 |
| 9 |
Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process Meled A, Zhuang Y, Wei X, Cheng J, Sampurno YA, Borucki L, Moinpour M, Hooper D, Philipossian A Journal of the Electrochemical Society, 157(3), H250, 2010 |
| 10 |
Pad flattening ratio, coefficient of friction and removal rate analysis during silicon dioxide chemical mechanical planarization Lee H, Zhuang Y, Sugiyama M, Seike Y, Takaoka M, Miyachi K, Nishiguchi T, Kojima H, Philipossian A Thin Solid Films, 518(8), 1994, 2010 |