| 1 |
Investigation of interface characteristics of Al2O3/Si under various O-2 plasma exposure times during the deposition of Al2O3 by PA-ALD
Min KH, Choi S, Jeong MS, Kang MG, Park S, Song HE, Lee JI, Kim D
Current Applied Physics, 19(2), 155, 2019 |
| 2 |
Damage to amorphous indium-gallium-zinc-oxide thin film transistors under Cl2 and BCl3 plasma
Choi JH, Kim SJ, Kim HT, Cho SM
Korean Journal of Chemical Engineering, 35(6), 1348, 2018 |
| 3 |
Characteristics of silicon oxynitride films grown by using neutral-beams and inductively coupled plasma
Kim J, Kim DC, Kim YW
Thin Solid Films, 642, 281, 2017 |
| 4 |
Hybrid ITO transparent conductive electrodes embedded with Pt nanoclusters for enhanced output efficiency of GaN-based light-emitting diodes
Gil Y, Kim H
Thin Solid Films, 603, 307, 2016 |
| 5 |
Plasma damage free sputtering of Ti-doped In2O3 film on Ag nanowire network for transparent and flexible electrodes
Seo KW, Kim HK
Thin Solid Films, 591, 301, 2015 |
| 6 |
Effects of the Modified TCO Sputtering Condition on ZnS/CIGS Solar Cell
Baek JY, Park SR, Yun TY, Han HJ, Kim KB, Jeon CW
Molecular Crystals and Liquid Crystals, 586(1), 76, 2013 |
| 7 |
Al2O3/Ag/Al2O3 multilayer thin film passivation prepared by plasma damage-free linear facing target sputtering for organic light emitting diodes
Jeong JA, Kim HK
Thin Solid Films, 547, 63, 2013 |
| 8 |
Characterization of tunnel-oxide degradation due to plasma field oxide recess in flash memory devices
Lee J, Kim DK, Min GJ, Chung I
Thin Solid Films, 520(15), 5007, 2012 |
| 9 |
New mechanism of plasma induced damage on CMOS image sensor: Analysis and process optimization
Carrere JP, Oddou JP, Place S, Richard C, Benoit D, Jenny C, Gatefait M, Aumont C, Tournier A, Roy F
Solid-State Electronics, 65-66, 51, 2011 |
| 10 |
Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance
Marsik P, Urbanowicz AM, Verdonck P, De Roest D, Sprey H, Baklanov MR
Thin Solid Films, 519(11), 3619, 2011 |
