| 1 |
Evolution of arsenic in high fluence plasma immersion ion implanted silicon: Behavior of the as-implanted Surface
Vishwanath V, Demenev E, Giubertoni D, Vanzetti L, Koh AL, Steinhauser G, Pepponi G, Bersani M, Meirer F, Foad MA
Applied Surface Science, 355, 792, 2015 |
| 2 |
질소 이온이 주입된 STS 316L 스테인리스 강에서의 상변화와 집합조직이 내식성에 미치는 영향
전신희, 공영민
Korean Journal of Materials Research, 25(6), 293, 2015 |
| 3 |
Characteristics of plasma immersion ion implantation treatment on tungsten nanocrystal nonvolatile memory
Lai CS, Wang JC, Chang LC, Liao YK, Chou PC, Chang WC, Ai CF, Tsai WF
Solid-State Electronics, 77, 31, 2012 |
| 4 |
Wear and corrosion behaviors of Ti6Al4V alloy biomedical materials by silver plasma immersion ion implantation process
Liu HX, Xu Q, Zhang XW, Wang CQ, Tang BY
Thin Solid Films, 521, 89, 2012 |
| 5 |
Effects of O-2 and H2O plasma immersion ion implantation on surface chemical composition and surface energy of poly vinyl chloride
Zhang W, Chu PK, Ji JH, Zhang YH, Jiang ZM
Applied Surface Science, 252(22), 7884, 2006 |
| 6 |
Formation of silicon on plasma synthesized SiOxNy and reaction mechanism
Zhu M, Shi XJ, Chen P, Liu WL, Wong M, Lin CL, Chu PK
Applied Surface Science, 243(1-4), 89, 2005 |
| 7 |
Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection
Chiu SY, Wang YL, Chang SC, Feng MS
Thin Solid Films, 478(1-2), 293, 2005 |
| 8 |
Palladium seeding on the tantalum-insulated silicon oxide film by plasma immersion ion implantation for the growth of electroless Copper
Lin JH, Tsai YY, Chiu SY, Lee TL, Tsai CM, Chen PH, Lin CC, Feng MS, Kou CS, Shih HC
Thin Solid Films, 377-378, 592, 2000 |
