검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of Bonding Agent on the Mechanical Properties of GAP High-Energy Propellant Deng JK, Wang XQ, Li GP, Luo YJ Propellants Explosives Pyrotechnics, 42(4), 394, 2017 |
| 2 |
Thermal analysis of microwave assisted bonding of poly(methyl methacrylate) substrates in microfluidic devices Mani KB, Hossan MR, Dutta P International Journal of Heat and Mass Transfer, 58(1-2), 229, 2013 |
| 3 |
Micropatterning and transferring of polymeric semiconductor thin films by hot lift-off and polymer bonding lithography in fabrication of organic field effect transistors (OFETs) on flexible substrate Yu XH, Wang Z, Yu SY, Ma DG, Han YC Applied Surface Science, 257(22), 9264, 2011 |