검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Electromigration cu mass flow in cu interconnections Hu CK, Canaperi D, Chen ST, Gignac LM, Kaldor S, Krishnan M, Malhotra SG, Liniger E, Lloyd JR, Rath DL, Restaino D, Rosenberg R, Rubino J, Seo SC, Simon A, Smith S, Tseng WT Thin Solid Films, 504(1-2), 274, 2006 |
| 2 |
Enhancement of semiconductor wafer cleaning by chelating agent addition Gale GW, Rath DL, Cooper EI, Estes S, Okorn-Schmidt HF, Brigante J, Jagannathan R, Settembre G, Adams E Journal of the Electrochemical Society, 148(9), G513, 2001 |
| 3 |
Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching Filippi RG, Gribelyuk MA, Joseph T, Kane T, Sullivan TD, Clevenger LA, Costrini G, Gambino J, Iggulden RC, Kiewra EW, Ning XJ, Ravikumar R, Schnabel RF, Stojakovic G, Weber SJ, Gignac LM, Hu CK, Rath DL, Rodbell KP Thin Solid Films, 388(1-2), 303, 2001 |