| 1 |
Characterization of reflow soldering at a peak temperature of 215 degrees C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball
Hwang JH, Lee JH
Applied Surface Science, 454, 227, 2018 |
| 2 |
Numerical simulation of supersonic separator with axial or tangential outlet in reflow channel
Hu DP, Wang YG, Ma C
Chemical Engineering and Processing, 124, 109, 2018 |
| 3 |
Formation of PtSn4 and PtSn in the initial reaction between Pt and molten Sn
Liu TY, Wang KK, Huang HC, Fang YS, Yeh CF, Hsu YW, Gan D, Huang HL
Thin Solid Films, 659, 64, 2018 |
| 4 |
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
Geczy A
International Journal of Heat and Mass Transfer, 109, 167, 2017 |
| 5 |
Reduction of capacity decay in vanadium flow batteries by an electrolyte-reflow method
Wang K, Liu L, Xi JY, Wu ZH, Qiu XP
Journal of Power Sources, 338, 17, 2017 |
| 6 |
Tirofiban induces vasorelaxation of the coronary artery via an endothelium-dependent NO-cGMP signaling by activating the PI3K/Akt/eNOS pathway
Xia TY, Guan WW, Fu JJ, Zou X, Han Y, Chen CY, Zhou L, Zeng CY, Wang WE
Biochemical and Biophysical Research Communications, 474(3), 599, 2016 |
| 7 |
Temperature prediction for system in package assembly during the reflow soldering process
Deng SS, Hwang SJ, Lee HH
International Journal of Heat and Mass Transfer, 98, 1, 2016 |
| 8 |
Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan
Najib AM, Abdullah MZ, Khor CY, Saad AA
International Journal of Heat and Mass Transfer, 87, 49, 2015 |
| 9 |
Numerical study of the gas flow velocity space in convection reflow oven
Illes B, Bako I
International Journal of Heat and Mass Transfer, 70, 185, 2014 |
| 10 |
Pitch reduction lithography by pressure-assisted selective wetting and thermal reflow
Um HS, Chae JJ, Lee SH, Rahmawan Y, Suh KY
Journal of Colloid and Interface Science, 376, 250, 2012 |
