검색결과 : 17건
| No. | Article |
|---|---|
| 1 |
Experiments on plasma immersion ion implantation inside conducting tubes embedded in an external magnetic field Pillaca EJDM, Ueda M, Reuther H, Pichon L, Lepienski CM Applied Surface Science, 357, 1438, 2015 |
| 2 |
Study of plasma immersion ion implantation into silicon substrate using magnetic mirror geometry Pillaca EJDM, Ueda M, Kostov KG, Reuther H Applied Surface Science, 258(24), 9564, 2012 |
| 3 |
Texture development, microstructure and phase transformation characteristics of sputtered Ni-Ti Shape Memory Alloy films grown on TiN < 111 > Martins RMS, Schell N, Reuther H, Pereira L, Mahesh KK, Silva RJC, Fernandes FMB Thin Solid Films, 519(1), 122, 2010 |
| 4 |
Tribological changes on SS304 stainless steel induced by nitrogen plasma immersion ion implantation with and without auxiliary heating Mello CB, Ueda M, Lepienski CM, Reuther H Applied Surface Science, 256(5), 1461, 2009 |
| 5 |
Spraying spin coating silanization at room temperature of a SiO2 surface for silicon-based integrated light emitters Cherkouk C, Rebohle L, Skorupa W, Strache T, Reuther H, Helm M Journal of Colloid and Interface Science, 337(2), 375, 2009 |
| 6 |
Surface improvement and biocompatibility of TiAl24Nb10 intermetallic alloy using rf plasma nitriding Ei-Rahman AMA, Maitz MF, Kassem MA, El-Hossary F, Prokert F, Reuther H, Pham MT, Richter E Applied Surface Science, 253(23), 9067, 2007 |
| 7 |
Strong improvement of the electroluminescence stability of SiO2 : Gd layers by potassium co-implantation Prucnal S, Sun JM, Reuther H, Skorupa W, Buchal C Electrochemical and Solid State Letters, 10(2), J30, 2007 |
| 8 |
Electrochemical behaviour of nickel surface-alloyed with copper and titanium Pham MT, Maitz MF, Richter E, Reuther H, Prokert F, Mucklich A Journal of Electroanalytical Chemistry, 572(1), 185, 2004 |
| 9 |
The effect of silicon ion implantation on the structure of tantalum-silicon contacts Peikert M, Bhandari R, Wieser E, Wenzel C, Lipp D, Reuther H, Mucklich A Thin Solid Films, 449(1-2), 187, 2004 |
| 10 |
Improvement of Ta-based thin film barriers on copper by ion implantation of nitrogen and oxygen Wieser E, Peikert M, Wenzel C, Schreiber J, Bartha JW, Bendjus B, Melov VV, Reuther H, Mucklich A, Adolphi B, Fischer D Thin Solid Films, 410(1-2), 121, 2002 |