| 1 |
Cyanide- and thiourea-free electrochemical etching of gold for microelectronics applications
Hu Z, Ritzdorf T
Journal of the Electrochemical Society, 154(10), D543, 2007 |
| 2 |
Superconformal electrochemical deposition of gold for metallization in microelectronic devices
Hu ZM, Ritzdorf T
Journal of the Electrochemical Society, 153(7), C467, 2006 |
| 3 |
Electrical waveform mediated through-mask deposition of solder bumps for wafer level packaging
Kim B, Ritzdorf T
Journal of the Electrochemical Society, 151(5), C342, 2004 |
| 4 |
Electrochemically deposited tin-silver-copper ternary solder alloys
Kim B, Ritzdorf T
Journal of the Electrochemical Society, 150(2), C53, 2003 |
| 5 |
Electrodeposition of near-eutectic SnAg solders for wafer-level packaging
Kim B, Ritzdorf T
Journal of the Electrochemical Society, 150(9), C577, 2003 |
| 6 |
Two- and three-dimensional numerical modeling of copper electroplating for advanced ULSI metallization
Ritter G, McHugh P, Wilson G, Ritzdorf T
Solid-State Electronics, 44(5), 797, 2000 |
