검색결과 : 14건
| No. | Article |
|---|---|
| 1 |
A universal 3D imaging sensor on a silicon photonics platform Rogers C, Piggott AY, Thomson DJ, Wiser RF, Opris IE, Fortune SA, Compston AJ, Gondarenko A, Meng FF, Chen X, Reed GT, Nicolaescu R Nature, 590(7845), 2021 |
| 2 |
Spatio-temporal bioaccumulation and trophic transfer of ionizable pharmaceuticals in a semi-arid urban river influenced by snowmelt Haddad SP, Luek A, Scott WC, Saari GN, Burket SR, Kristofco LA, Corrales J, Rasmussen JB, Chambliss CK, Luers M, Rogers C, Brooks BW Journal of Hazardous Materials, 359, 231, 2018 |
| 3 |
Synergistic Enhancement of Electrocatalytic CO2 Reduction with Gold Nanoparticles Embedded in Functional Graphene Nanoribbon Composite Electrodes Rogers C, Perkins WS, Veber G, Williams TE, Cloke RR, Fischer FR Journal of the American Chemical Society, 139(11), 4052, 2017 |
| 4 |
The Benefits of Seal-less Pumps for Full Product Containment Rogers C, Ortega N Chemical Engineering, 122(9), 52, 2015 |
| 5 |
Synchronous, In Situ Measurements in Chemical Mechanical Planarization Vlahakis J, Rogers C, Manno VP, White R, Moinpour M, Hooper D, Anjur S Journal of the Electrochemical Society, 156(10), H794, 2009 |
| 6 |
In Situ Investigation of Slurry Flow Fields during CMP Mueller N, Rogers C, Manno VP, White R, Moinpour M Journal of the Electrochemical Society, 156(12), H908, 2009 |
| 7 |
Effects of disk design and kinematics of conditioners on process hydrodynamics during copper CMP Li ZL, Lee H, Borucki L, Rogers C, Kikuma R, Rikita N, Nagasawa K, Philipossian A Journal of the Electrochemical Society, 153(5), G399, 2006 |
| 8 |
Viewing asperity behavior under the wafer during CMP Gray C, Apone D, Rogers C, Manno VP, Barns C, Moinpour M, Anjur S, Philipossian A Electrochemical and Solid State Letters, 8(5), G109, 2005 |
| 9 |
Measurements of slurry film thickness and wafer drag during CMP Lu J, Rogers C, Manno VP, Philipossian A, Anjur S, Moinpourd M Journal of the Electrochemical Society, 151(4), G241, 2004 |
| 10 |
Investigating slurry transport beneath a wafer during chemical mechanical polishing processes Coppeta J, Rogers C, Racz L, Philipossian A, Kaufman FB Journal of the Electrochemical Society, 147(5), 1903, 2000 |