검색결과 : 8건
| No. | Article |
|---|---|
| 1 |
Effectiveness of Ti, TiN, Ta, TaN, and W2N as barriers for the integration of low-k dielectric hydrogen silsesquioxane Zeng YX, Russell SW, McKerrow AJ, Chen LH, Alford TL Journal of Vacuum Science & Technology B, 18(1), 221, 2000 |
| 2 |
Thin film interaction between low-k dielectric hydrogen silsesquioxane (HSQ) and Ti barrier layer Zeng YX, Russell SW, McKerrow AJ, Chen PJ, Alford TL Thin Solid Films, 360(1-2), 283, 2000 |
| 3 |
Titanium Nitridation on Copper Surfaces Russell SW, Rack MJ, Adams D, Alford TL, Levine TE, Nastasi M Journal of the Electrochemical Society, 143(7), 2349, 1996 |
| 4 |
Dealloying Kinetics of Cu1-Xtix on SiO2 Using in-Situ X-Ray Diffraction Russell SW, Alford TL, Mayer JW Journal of the Electrochemical Society, 142(4), 1308, 1995 |
| 5 |
Enhanced Adhesion of Copper to Dielectrics via Titanium and Chromium Additions and Sacrificial Reactions Russell SW, Rafalski SA, Spreitzer RL, Li J, Moinpour M, Moghadam F, Alford TL Thin Solid Films, 262(1-2), 154, 1995 |
| 6 |
Passivation of Cu via Refractory-Metal Nitridation in an Ammonia Ambient Adams D, Alford TL, Theodore ND, Russell SW, Spreitzer RL, Mayer JW Thin Solid Films, 262(1-2), 199, 1995 |
| 7 |
Segregation of Cu in Cu(Ti) Alloys During Nitridation in NH3 Adams D, Alford TL, Theodore ND, Russell SW Thin Solid Films, 270(1-2), 346, 1995 |
| 8 |
Efficient Manganese Catalysts for Low-Temperature Bleaching Hage R, Iburg JE, Kerschner J, Koek JH, Lempers EL, Martens RJ, Racherla US, Russell SW, Swarthoff T, Vanvliet MR, Warnaar JB, Vanderwolf L, Krijnen B Nature, 369(6482), 637, 1994 |