| 1 |
Er0.4Bi1.6O3 thin films in situ crystallized at low temperature onto the Gd0.1Ce0.9O1.95 bulk electrolytes via Facing Target Sputtering
Jeung JN, Eom JH, Park BJ, Kim SD, Yoon SG
Current Applied Physics, 17(5), 751, 2017 |
| 2 |
Wafer-scale, conformal and direct growth of MoS2 thin films by atomic layer deposition
Jang Y, Yeo S, Lee HBR, Kim H, Kim SH
Applied Surface Science, 365, 160, 2016 |
| 3 |
Filling performance and electrical characteristics of Al2O3 films deposited by atomic layer deposition for through-silicon via applications
Choi KK, Kee J, Kim SH, Park MS, Park CG, Kim DK
Thin Solid Films, 556, 560, 2014 |
| 4 |
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect
Mun KY, Hong TE, Cheon T, Jang YJ, Lim BY, Kim S, Kim SH
Thin Solid Films, 562, 118, 2014 |
| 5 |
Low temperature deposition of titanium oxide containing thin films in trench features from titanium diisopropoxide bis(dipivaloylmethanate) in supercritical CO2
Kano F, Uchida H, Koda S
Journal of Supercritical Fluids, 50(3), 313, 2009 |
| 6 |
Initiated chemical vapor deposition of polymer films on nonplanar substrates
Baxamusa SH, Gleason KK
Thin Solid Films, 517(12), 3536, 2009 |
| 7 |
Customized step coverage of copper seed layer using Eni-PVD (energetic neutral and ion physical vapor deposition)
Lim ST, Park YC, Yoo SJ, Lee BJ
Thin Solid Films, 517(14), 3935, 2009 |
| 8 |
Modeling Titanium Oxide Growth by Chemical Vapor Deposition Using Titanium Tetra Isopropoxide
Akiyama Y, Shitanaka K, Murakami H
Journal of Chemical Engineering of Japan, 41(8), 779, 2008 |
| 9 |
Coverage properties of SiNx films prepared by catalytic chemical vapor deposition on trenched substrates below 80 degrees C
Heya A, Minamikawa T, Niki T, Minami S, Masuda A, Umemoto H, Matsuo N, Matsumura H
Thin Solid Films, 516(10), 3000, 2008 |
| 10 |
Step coverage study of indium-tin-oxide thin films by spray CVD on non-flat substrates at different temperatures
Kondo T, Sawada Y, Akiyama K, Funakubo H, Kiguchi T, Seki S, Wang MH, Uchida T
Thin Solid Films, 516(17), 5864, 2008 |
