검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Control of oxidation on NiSix during etching and ashing processes Sakamori S, Yonekura K, Fujiwara N, Kosaka T, Ohkuni M, Tateiwa K Thin Solid Films, 515(12), 4933, 2007 |
| 2 |
Suppression of 193-nm photoresist deformation by H-2 addition to fluorocarbon plasma in via-hole etching Yonekura K, Yoshikawa K, Fujiwara Y, Sakamori S, Fujiwara N, Kosaka T, Ohkuni M, Tateiwa K Thin Solid Films, 515(12), 5012, 2007 |
| 3 |
Prevention of Cu degradation using in situ N-2 plasma treatment in a dual-damascene process Tomohisa S, Yoshikawa K, Yonekura K, Sakamori S, Fujiwara N, Tsujimoto K, Nishioka K, Kobayashi H, Oomori T Journal of Vacuum Science & Technology B, 23(5), 2084, 2005 |
| 4 |
Investigation of ash damage to ultralow-k inorganic materials Yonekura K, Sakamori S, Goto K, Matsuura M, Fujiwara N, Yoneda M Journal of Vacuum Science & Technology B, 22(2), 548, 2004 |
| 5 |
Reduction in contact resistance with in situ O-2 plasma treatment Yonekura K, Sakamori S, Kawai K, Miyatake H Journal of the Electrochemical Society, 145(7), 2480, 1998 |