검색결과 : 11건
| No. | Article |
|---|---|
| 1 |
Effect of Slurry Application/Injection Schemes on Slurry Availability during Chemical Mechanical Planarization (CMP) Liao XY, Sampurno Y, Zhuang Y, Philipossian A Electrochemical and Solid State Letters, 15(4), H118, 2012 |
| 2 |
Tribological, Thermal and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes Jiao YB, Liao XY, Wu CH, Theng S, Zhuang Y, Sampurno Y, Goldstein M, Philipossian A Journal of the Electrochemical Society, 159(3), H255, 2012 |
| 3 |
An Approach for Correlating Friction Force and Removal Rate to Pad Topography during Tungsten Chemical Mechanical Planarization Sampurno Y, Rice A, Zhuang Y, Philipossian A Electrochemical and Solid State Letters, 14(8), H318, 2011 |
| 4 |
Slurry-Induced Pad Wear Rate in Chemical Mechanical Planarization Meled A, Sampurno Y, Zhuang Y, Philipossiana A Electrochemical and Solid State Letters, 13(3), H52, 2010 |
| 5 |
Tribological, Thermal, and Wear Characteristics of Poly(phenylene sulfide) and Polyetheretherketone Retaining Rings in Interlayer Dielectric CMP Wei XM, Zhuang Y, Sampurno Y, Sudargho F, Wargo C, Borucki L, Philipossian A Electrochemical and Solid State Letters, 13(11), H391, 2010 |
| 6 |
Diamond Disc Diagnostic Method Based on "Dry" Coefficient of Friction Measurements Meled A, Sampurno Y, Sudargho F, Zhuang Y, Philipossian A Electrochemical and Solid State Letters, 13(12), H457, 2010 |
| 7 |
Effect of Cerium Oxide Particle Sizes in Oxide Chemical Mechanical Planarization Sampurno Y, Sudargho F, Zhuang Y, Ashizawa T, Morishima H, Philipossian A Electrochemical and Solid State Letters, 12(6), H191, 2009 |
| 8 |
Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications Sampurno Y, Borucki L, Zhuang Y, Misra S, Holland K, Boning D, Philipossian A Thin Solid Films, 517(5), 1719, 2009 |
| 9 |
Evaluation of pad groove designs under reduced slurry flow rate conditions during copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Sampurno Y, Philipossian A Journal of the Electrochemical Society, 155(10), H812, 2008 |
| 10 |
Feasibility of real-time detection of abnormality in inter layer dielectric slurry during chemical mechanical planarization using frictional analysis Sampurno Y, Sudargho F, Zhuang Y, Goldstein M, Philipossian A Thin Solid Films, 516(21), 7667, 2008 |