검색결과 : 9건
| No. | Article |
|---|---|
| 1 |
Effects of Electroplating at Lower Leveler and Suppressor Contents on the Formation of Very Low Resistivity Narrow Cu Interconnects Miyamoto R, Tamahashi K, Inami T, Sasajima Y, Onuki J Journal of the Electrochemical Society, 166(4), D137, 2019 |
| 2 |
Screening of Undesirable Elements Raising the Electrical Resistivity in Very Narrow Cu Wires by Ab Initio Calculation Nagano T, Tamahashi K, Inami T, Sasajima Y, Onuki J Journal of the Electrochemical Society, 164(9), D558, 2017 |
| 3 |
Resistivity Reduction in Very Narrow Cu Wiring Onuki J, Sasajima Y, Tamahashi K, Ke YQ, Terada S, Hidaka K, Itoh S Journal of the Electrochemical Society, 160(12), D3266, 2013 |
| 4 |
Substrate temperature dependence of electrical and structural properties of Ru films Nagano T, Inokuchi K, Tamahashi K, Ishikawa N, Sasajima Y, Onuki J Thin Solid Films, 520(1), 374, 2011 |
| 5 |
Grain coarsening mechanism of Cu thin films by rapid annealing Sasajima Y, Kageyama J, Khoo K, Onuki J Thin Solid Films, 518(23), 6883, 2010 |
| 6 |
Detection of protein tyrosine phosphorylation by open sandwich fluoroimmunoassay Sasajima Y, Aburatani T, Sakamoto K, Ueda H Biotechnology Progress, 22(4), 968, 2006 |
| 7 |
A novel EID family member, EID-3, inhibits differentiation and forms a homodimer or heterodimer with EID-2 Sasajima Y, Tanaka H, Miyake S, Yuasa Y Biochemical and Biophysical Research Communications, 333(3), 969, 2005 |
| 8 |
Molecular dynamics study of cluster deposition in thermal plasma flash evaporation Yamaguchi N, Sasajima Y, Terashima K, Yoshida T Thin Solid Films, 345(1), 34, 1999 |
| 9 |
Monte-Carlo Simulations of Film Growth Ozawa S, Sasajima Y, Heermann DW Thin Solid Films, 272(2), 172, 1996 |