검색결과 : 13건
| No. | Article |
|---|---|
| 1 |
Step and flash imprint lithography for manufacturing patterned media Schmid GM, Miller M, Brooks C, Khusnatdinov N, LaBrake D, Resnick DJ, Sreenivasan SV, Gauzner G, Lee K, Kuo D, Weller D, Yang XM Journal of Vacuum Science & Technology B, 27(2), 573, 2009 |
| 2 |
Implementation of an imprint damascene process for interconnect fabrication Schmid GM, Stewart MD, Wetzel J, Palmieri F, Hao JJ, Nishimura Y, Jen K, Kim EK, Resnick DJ, Liddle JA, Willson CG Journal of Vacuum Science & Technology B, 24(3), 1283, 2006 |
| 3 |
Quantifying acid generation efficiency for photoresist applications Tsiartas PC, Schmid GM, Johnson HF, Stewart MD, Willson CG Journal of Vacuum Science & Technology B, 23(1), 224, 2005 |
| 4 |
Formation of deprotected fuzzy blobs in chemically amplified resists Jones RL, Hu TJ, Lin EK, Wu WL, Goldfarb DL, Angelopoulos M, Trinque BC, Schmid GM, Stewart MD, Willson CG Journal of Polymer Science Part B: Polymer Physics, 42(17), 3063, 2004 |
| 5 |
Mesoscale Monte Carlo simulation of photoresist processing Schmid GM, Stewart MD, Burns SD, Willson CG Journal of the Electrochemical Society, 151(2), G155, 2004 |
| 6 |
Nonaqueous development of silsesquioxane electron beam resist Schmid GM, Carpenter LE, Liddle JA Journal of Vacuum Science & Technology B, 22(6), 3497, 2004 |
| 7 |
Spatial distribution of reaction products in positive tone chemically amplified resists Schmid GM, Stewart MD, Singh VK, Willson CG Journal of Vacuum Science & Technology B, 20(1), 185, 2002 |
| 8 |
Advancements to the critical ionization dissolution model Burns SD, Schmid GM, Tsiartas PC, Willson CG, Flanagin L Journal of Vacuum Science & Technology B, 20(2), 537, 2002 |
| 9 |
Electrostatic effects during dissolution of positive tone photoresists Schmid GM, Burns SD, Tsiartas PC, Willson CG Journal of Vacuum Science & Technology B, 20(6), 2913, 2002 |
| 10 |
Acid catalyst mobility in resist resins Stewart MD, Tran HV, Schmid GM, Stachowiak TB, Becker DJ, Willson CG Journal of Vacuum Science & Technology B, 20(6), 2946, 2002 |