검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
Elastohydrodynamics of Roll-to-Roll UV-Cure Imprint Lithography Cochrane A, Tjiptowidjojo K, Bonnecaze RT, Schunk PR Industrial & Engineering Chemistry Research, 58(37), 17424, 2019 |
| 2 |
Elastohydrodynamics of Roll-to-Roll UV-Cure Imprint Lithography Cochrane A, Tjiptowidjojo K, Bonnecaze RT, Schunk PR Industrial & Engineering Chemistry Research, 58(37), 17424, 2019 |
| 3 |
Multiphase model for nanoimprint lithography Cochrane A, Tjiptowidjojo K, Bonnecaze RT, Schunk PR International Journal of Multiphase Flow, 104, 9, 2018 |
| 4 |
Composition and Manufacturing Effects on Electrical Conductivity of Li/FeS2 Thermal Battery Cathodes Reinholz EL, Roberts SA, Apblett CA, Lechman JB, Schunk PR Journal of the Electrochemical Society, 163(8), A1723, 2016 |
| 5 |
A reduced-order model for porous flow through thin, structured materials Roberts SA, Schunk PR International Journal of Multiphase Flow, 67, 25, 2014 |
| 6 |
Performance of mesoscale modeling methods for predicting rheological properties of charged polystyrene/water suspensions Schunk PR, Pierce F, Lechman JB, Grillet AM, Veld PJI, Weiss H, Stoltz C, Heine DR Journal of Rheology, 56(2), 353, 2012 |
| 7 |
Transformation of a Close-Packed Au Nanoparticle/Polymer Monolayer into a Large Area Array of Oriented Au Nanowires via E-beam Promoted Uniaxial Deformation and Room Temperature Sintering Xiong SS, Molecke R, Bosch M, Schunk PR, Brinker CJ Journal of the American Chemical Society, 133(30), 11410, 2011 |
| 8 |
Comment on "Hydrophilicity and the Viscosity of Interfacial Water" Moore NW, Tjiptowidjojo K, Schunk PR Langmuir, 27(6), 3211, 2011 |
| 9 |
Predicting polymer flow during high-temperature atomic force microscope nanoindentation Rowland HD, King WP, Sun AC, Schunk PR, Cross GLW Macromolecules, 40(22), 8096, 2007 |
| 10 |
Simulations of nonuniform embossing: The effect of asymmetric neighbor cavities on polymer flow during nanoimprint lithography Rowland HD, King WP, Sun AC, Schunk PR Journal of Vacuum Science & Technology B, 23(6), 2958, 2005 |