| 1 |
Microstructure and mechanical properties of sputter deposited tantalum nitride thin films after high temperature loading
Grosser M, Seidel H, Schmid U
Thin Solid Films, 629, 69, 2017 |
| 2 |
On-chip nanostructuring and impedance trimming of transparent and flexible ITO electrodes by laser induced coherent sub-20 nm cuts
Afshar M, Leber M, Poppendieck W, Konig K, Seidel H, Feili D
Applied Surface Science, 360, 494, 2016 |
| 3 |
Sputtered Pt electrode structures with smoothly tapered edges by bi-layer resist lift-off
Preiss EM, Krauss A, Seidel H
Thin Solid Films, 597, 158, 2015 |
| 4 |
Incubation and nanostructure formation on n- and p-type Si(100) and Si(111) at various doping levels induced by sub-nanojoule femto- and picosecond near-infrared laser pulses
Schule M, Afshar M, Feili D, Seidel H, Konig K, Straub M
Applied Surface Science, 314, 21, 2014 |
| 5 |
The impact of substrate properties and thermal annealing on tantalum nitride thin films
Grosser M, Munch M, Seidel H, Bienert C, Roosen A, Schmid U
Applied Surface Science, 258(7), 2894, 2012 |
| 6 |
c-axis orientation and piezoelectric coefficients of AlN thin films sputter-deposited on titanium bottom electrodes
Ababneh A, Alsumady M, Seidel H, Manzaneque T, Hernando-Garcia J, Sanchez-Rojas JL, Bittner A, Schmid U
Applied Surface Science, 259, 59, 2012 |
| 7 |
Influence of the crystal orientation on the electrical properties of AlN thin films on LTCC substrates
Bittner A, Ababneh A, Seidel H, Schmid U
Applied Surface Science, 257(3), 1088, 2010 |
| 8 |
High-Frequency Characterization of Porous Low-Temperature Cofired Ceramics Substrates
Bittner A, Seidel H, Schmid U
Journal of the American Ceramic Society, 93(11), 3778, 2010 |
| 9 |
Investigation of the interaction between electrical discharges and low resistivity silicon substrates
Soldera F, Burdiles G, Schmid U, Seidel H, Mucklich F
Applied Surface Science, 254(7), 2150, 2008 |
| 10 |
Effect of high temperature annealing on the electrical performance of titanium/platinum thin films
Schmid U, Seidel H
Thin Solid Films, 516(6), 898, 2008 |
