검색결과 : 28건
| No. | Article |
|---|---|
| 1 |
Oxidative chemical vapor deposition of polyacenaphthylene, polyacenaphthene, and polyindane via benzoyl peroxide Senkevich JJ Thin Solid Films, 556, 23, 2014 |
| 2 |
Method for measuring solvent permeation through polymer film on porous dielectric films Geil RD, Senkevich JJ, Rogers BR Journal of Vacuum Science & Technology B, 27(4), 1825, 2009 |
| 3 |
Electrochemically deposited ruthenium seed layer followed by copper electrochemical plating Kim YS, Kim HI, Dar MA, Seo HK, Kim GS, Ansari SG, Senkevich JJ, Shin HS Electrochemical and Solid State Letters, 9(1), C19, 2006 |
| 4 |
Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer Kim YS, Kim HI, Cho JH, Seo HK, Dar MA, Shin HS, Ten Eyck GA, Lu TM, Senkevich JJ Electrochimica Acta, 51(12), 2400, 2006 |
| 5 |
Electrochemical deposition of copper and ruthenium on titanium Kim YS, Kim HI, Cho JH, Seo HK, Kim GS, Ansari SG, Khang G, Senkevich JJ, Shin HS Electrochimica Acta, 51(25), 5445, 2006 |
| 6 |
Adhesion aspects of poly(p-xylylene) to SiO2 surfaces using gamma-methacryloxypropyltrimethoxysilane as an adhesion promoter Mitchell CJ, Yang GR, Senkevich JJ Journal of Adhesion Science and Technology, 20(14), 1637, 2006 |
| 7 |
Formation of body-centered-cubic tantalum via sputtering on low-kappa dielectrics at low temperatures Senkevich JJ, Karabacak T, Bae DL, Cale TS Journal of Vacuum Science & Technology B, 24(2), 534, 2006 |
| 8 |
Inductively coupled hydrogen plasma-assisted Cu ALD on metallic and dielectric surfaces Jezewski C, Lanford WA, Wiegand CJ, Singh JP, Wang PI, Senkevich JJ, Lu TM Journal of the Electrochemical Society, 152(2), C60, 2005 |
| 9 |
Direct copper electroless deposition on a tungsten barrier layer for ultralarge scale integration Kim YS, Bae DL, Yang HC, Shin HS, Wang GW, Senkevich JJ, Lu TM Journal of the Electrochemical Society, 152(2), C89, 2005 |
| 10 |
Atomic layer deposition of Pd on TaN for Cu electroless plating Kim Y, Ten Eyck GA, Ye DX, Jezewski C, Karabacak T, Shin HS, Senkevich JJ, Lu TM Journal of the Electrochemical Society, 152(6), C376, 2005 |