검색결과 : 2건
No. | Article |
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1 |
Effects of Addition of Resin Particles to Ceria-Based Slurry on Pre-Metal Dielectric Planarization Matsui Y, Eda H, Seta S, Ono T, Tateyama Y, Nishioka T, Yano H, Masuko M Journal of the Electrochemical Society, 157(5), H510, 2010 |
2 |
High Performance Photoresist Planarization Process by CMP with Resin Abrasive for Trench-First Cu/Low-k Dual Damascene Process Matsui Y, Seta S, Kinoshita M, Tateyama Y, Shigeta A, Nishioka T, Yano H, Shida H, Nishimoto K, Masuko M Journal of the Electrochemical Society, 156(7), H548, 2009 |