화학공학소재연구정보센터
검색결과 : 2건
No. Article
1 Effects of Addition of Resin Particles to Ceria-Based Slurry on Pre-Metal Dielectric Planarization
Matsui Y, Eda H, Seta S, Ono T, Tateyama Y, Nishioka T, Yano H, Masuko M
Journal of the Electrochemical Society, 157(5), H510, 2010
2 High Performance Photoresist Planarization Process by CMP with Resin Abrasive for Trench-First Cu/Low-k Dual Damascene Process
Matsui Y, Seta S, Kinoshita M, Tateyama Y, Shigeta A, Nishioka T, Yano H, Shida H, Nishimoto K, Masuko M
Journal of the Electrochemical Society, 156(7), H548, 2009