검색결과 : 7건
| No. | Article |
|---|---|
| 1 |
Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration Dubin VM, Shachamdiamand Y, Zhao B, Vasudev PK, Ting CH Journal of the Electrochemical Society, 144(3), 898, 1997 |
| 2 |
Simulation of Electroless Deposition of Cu Thin-Films for Very Large-Scale Integration Metallization Smy T, Tan L, Dew SK, Brett MJ, Shachamdiamand Y, Desilva M Journal of the Electrochemical Society, 144(6), 2115, 1997 |
| 3 |
High-Aspect-Ratio Microtunnel Technique to Empirically Model Electroless Deposition Desilva M, Shachamdiamand Y, Soave R, Kim HS Journal of the Electrochemical Society, 143(4), L78, 1996 |
| 4 |
A Novel Seed Layer Scheme to Protect Catalytic Surfaces for Electroless Deposition Desilva MJ, Shachamdiamand Y Journal of the Electrochemical Society, 143(11), 3512, 1996 |
| 5 |
Rapid Thermal-Diffusion of Sn from Spin-on-Glass into GaAs Hernandes CS, Swart JW, Pudenzi MA, Kraus GT, Shachamdiamand Y, Giannelis EP Journal of the Electrochemical Society, 142(8), 2829, 1995 |
| 6 |
A Novel Technique for Characterizing the Surface Coverage of Thin-Film Chemical-Vapor-Deposition in Ultra-High-Aspect-Ratio Microstructures Soave RJ, Tasker GW, Then AM, Mayer JW, Shachamdiamand Y Journal of Vacuum Science & Technology A, 13(3), 1027, 1995 |
| 7 |
Electroless Copper Deposition for ULSI Shachamdiamand Y, Dubin V, Angyal M Thin Solid Films, 262(1-2), 93, 1995 |