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| No. | Article |
|---|---|
| 1 |
Eliminating Metal-Sputter Contamination in Ion Implanter for Low-Temperature-Annealed, Low-Reverse-Bias-Current Junctions Tomita K, Migita T, Shimonishi S, Shibata T, Ohmi T, Nitta T Journal of the Electrochemical Society, 142(5), 1692, 1995 |