검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy Jo JL, Lee JB, Kim JM, Shin YE, Jung SB Journal of Adhesion, 86(5-6), 470, 2010 |
| 2 |
Selection of proper fatigue model for flip chip package reliability Shin YE, Kim YS, Kim HI, Kim JM, Chang KH, Farson DF Materials Science Forum, 502, 393, 2005 |
| 3 |
Effect of viscosity of liquid resin on resin self-alignment capability Kim JM, Shin YE, Fujimoto K Materials Science Forum, 439, 12, 2003 |